RF and Microwave Module Level Design and Integration

Cover
Title
Copyright
Contents
Preface
Acknowledgments
List of abbreviations
1 RF and microwave device and module packaging
    1.1 Introduction
    1.2 Packaging technologies
        1.2.1 System on chip
        1.2.2 System on package
        1.2.3 System in package
        1.2.4 Wafer level packaging
        1.2.5 Other packaging technologies
    1.3 Microelectronics fabrication
        1.3.1 Photolithography fabrication
        1.3.2 Substrate technologies
        1.3.3 Microelectronics metallization and characterization
        1.3.4 Dielectric permittivity characterization
        1.3.5 Cleanroom classifications
    1.4 RF and microwave module types
        1.4.1 Monolithic modules
        1.4.2 Hybrid modules
        1.4.3 Multichip modules
    References
2 Lumped and distributed passive elements
    2.1 Introduction
    2.2 Lumped elements
        2.2.1 Resistors
        2.2.2 Capacitors
        2.2.3 Inductors
    2.3 Distributed elements
    2.4 Design considerations
        2.4.1 Self-resonant frequency
        2.4.2 Reactance slope
        2.4.3 Inductor orientation
    2.5 Miniaturization of distributed elements
        2.5.1 High permittivity materials
        2.5.2 Capacitively loaded transmission line
    2.6 Quality factor calculation
        2.6.1 Q-factor improvement methods of inductors
    References
3 Basics of microwave network analysis
    3.1 Introduction
    3.2 Microwave port analysis
        3.2.1 Voltage–current-based parameters
        3.2.2 Traveling wave-based parameters
    3.3 Microwave network basic properties
        3.3.1 Linearity
        3.3.2 Time invariance
        3.3.3 Reciprocity
        3.3.4 Symmetry
        3.3.5 Passivity
        3.3.6 Lossless
    3.4 Signal flow graph
    3.5 De-embedding and embedding S-parameters
    3.6 Two-port equivalent circuits
    3.7 Passive and lossless circuit synthesis
        3.7.1 Singly and doubly terminated networks
        3.7.2 One-port circuit synthesis
        3.7.3 Two-port circuit synthesis
    References
4 Impedance matching networks
    4.1 Introduction
    4.2 Power transfer and power efficiency
    4.3 Theoretical limitation on lossless matching networks
    4.4 Single reactive element matching
    4.5 Reactive L-section matching networks
        4.5.1 Case I: RL > Re{Z0}
        4.5.2 Case II: RL < Re{Z0}
    4.6 T- and π-matching networks
        4.6.1 T-matching Circuit
        4.6.2 p-matching circuit
        4.6.3 Inverters
    4.7 Impedance matching using transformers
    4.8 Tapped capacitor resonator matching network
    4.9 Transmission lines-based matching networks
        4.9.1 Quarter wavelength transformer
        4.9.2 Radial stub
        4.9.3 Multisection transformer
        4.9.4 Tapered transmission lines
        4.9.5 Nonuniform transmission lines
    4.10 Power gains
    4.11 Source- and load-pull analysis
    4.12 Design considerations
    References
5 Electromagnetic field couplings
    5.1 Introduction
    5.2 Electromagnetic coupling types
        5.2.1 Inductive coupling
        5.2.2 Capacitive coupling
        5.2.3 Mixed coupling
        5.2.4 Common path coupling
    5.3 Coupled transmission lines
        5.3.1 Single transmission line
        5.3.2 Symmetric coupled transmission lines
        5.3.3 Asymmetrical coupled transmission lines
        5.3.4 Additivity of electric and magnetic coupling
    5.4 EM fields and shielding
        5.4.1 Electromagnetic field boundary conditions
        5.4.2 Near-, transition-, and far-field regions
        5.4.3 Electromagnetic shielding
        5.4.4 Interconnects shielding by via fence
    5.5 Anisotropic laminate materials
    5.6 PCB and laminate design considerations
    References
6 CAD of RF and microwave circuits and modules
    6.1 Introduction
    6.2 Computational electromagnetic-based simulators
        6.2.1 Commercially available CEM tools
        6.2.2 Limitations of different CEM methods
        6.2.3 Boundary conditions
        6.2.4 Volumetric and surface mesh
    6.3 Circuit theory-based simulators
        6.3.1 Linear circuit simulators
        6.3.2 Nonlinear circuit simulators
    6.4 Domain decomposition for system level co-simulations
        6.4.1 Linear and nonlinear simulations
        6.4.2 Electro-thermal simulations
        6.4.3 Electro-acoustic simulations
        6.4.4 Module integration
    6.5 RF and microwave modeling
        6.5.1 Polynomial curve-fit-based modeling
        6.5.2 Machine learning-based modeling
        6.5.3 Automatic model generation
    6.6 Power handling analysis
    6.7 Electromagnetic compatibility analysis
    6.8 Monte Carlo yield analysis and optimization
    6.9 Circuit elements sensitivity
    6.10 Six Sigma
    References
7 Components of RF front-end modules
    7.1 Introduction
    7.2 RF power amplifiers
        7.2.1 Classes of power amplifiers
        7.2.2 Common PA configurations
        7.2.3 PA stability
        7.2.4 PA linearization
        7.2.5 PA biasing
        7.2.6 PA distortion
    7.3 Low noise amplifiers
    7.4 RF switches
        7.4.1 PIN diode switches
        7.4.2 FET switches
    7.5 Phase shifters
    7.6 RF filters
        7.6.1 RF passive filters
        7.6.2 RF active filters
    7.7 CMOS controllers
    7.8 RF circulators and isolators
    7.9 RF mixers
    7.10 RF oscillators
    7.11 Microwave baluns
    7.12 RF power limiters
    7.13 Diversity antennas
    References
8 Component- and module-level measurements
    8.1 Introduction
    8.2 Small-signal measurements
    8.3 Large-signal measurements
        8.3.1 Transmitter-related measurements
        8.3.2 Receiver-related measurements
    8.4 Radiated immunity and emission measurement
    8.5 Wafer-level RF measurement
    8.6 Phase stability in RF test cables
    8.7 Port reduction method
    References
Index