RF and Microwave Circuit Design: Theory and Applications
- Length: 528 pages
- Edition: 1
- Language: English
- Publisher: Wiley
- Publication Date: 2021-11-08
- ISBN-10: 1119114632
- ISBN-13: 9781119114635
- Sales Rank: #0 (See Top 100 Books)
This textbook covers a typical modern syllabus in radio frequency or microwave design at final year undergraduate or first year postgraduate level. The content has been chosen to include all of the basic topics necessary to give a rigorous introduction to high-frequency technology. Both the content and presentation reflect the considerable experience which both authors have in teaching and research at university level. The material is presented from first principles, and relies only on students having a reasonable grasp of basic electronic principles. One of the key features of the book is the inclusion of an extensive set of worked examples to guide the student reader who has no prior knowledge of the subject.
Cover Title Page Copyright Contents Preface About the Companion Website Chapter 1 RF Transmission Lines 1.1 Introduction 1.2 Voltage, Current, and Impedance Relationships on a Transmission Line 1.3 Propagation Constant 1.3.1 Dispersion 1.3.2 Amplitude Distortion 1.4 Lossless Transmission Lines 1.5 Matched and Mismatched Transmission Lines 1.6 Waves on a Transmission Line 1.7 The Smith Chart 1.7.1 Derivation of the Smith Chart 1.7.2 Properties of the Smith Chart 1.8 Stubs 1.9 Distributed Matching Circuits 1.10 Manipulation of Lumped Impedances Using the Smith Chart 1.11 Lumped Impedance Matching 1.11.1 Matching a Complex Load Impedance to a Real Source Impedance 1.11.2 Matching a Complex Load Impedance to a Complex Source Impedance 1.12 Equivalent Lumped Circuit of a Lossless Transmission Line 1.13 Supplementary Problems Appendix 1.A Coaxial Cable 1.A.1 Electromagnetic Field Patterns in Coaxial Cable 1.A.2 Essential Properties of Coaxial Cables Appendix 1.B Coplanar Waveguide 1.B.1 Structure of Coplanar Waveguide (CPW) 1.B.2 Electromagnetic Field Distribution on a CPW Line 1.B.3 Essential Properties of Coplanar (CPW) Lines 1.B.4 Summary of Key Points Relating to CPW Lines Appendix 1.C Metal Waveguide 1.C.1 Waveguide Principles 1.C.2 Waveguide Propagation 1.C.3 Rectangular Waveguide Modes 1.C.4 The Waveguide Equation 1.C.5 Phase and Group Velocities 1.C.6 Field Theory Analysis of Rectangular Waveguides 1.C.7 Waveguide Impedance 1.C.8 Higher‐Order Rectangular Waveguide Modes 1.C.9 Waveguide Attenuation 1.C.10 Sizes of Rectangular Waveguide and Waveguide Designation 1.C.11 Circular Waveguide References Chapter 2 Planar Circuit Design I 2.1 Introduction 2.2 Electromagnetic Field Distribution Across a Microstrip Line 2.3 Effective Relative Permittivity, εr,eff MSTRIP 2.4 Microstrip Design Graphs and CAD Software 2.5 Operating Frequency Limitations 2.6 Skin Depth 2.7 Examples of Microstrip Components 2.7.1 Branch‐Line Coupler 2.7.2 Quarter‐Wave Transformer 2.7.3 Wilkinson Power Divider 2.8 Microstrip Coupled‐Line Structures 2.8.1 Analysis of Microstrip Coupled Lines 2.8.2 Microstrip Directional Couplers 2.8.2.1 Design of Microstrip Directional Couplers 2.8.2.2 Directivity of Microstrip Directional Couplers 2.8.2.3 Improvements to Microstrip Directional Couplers 2.8.3 Examples of Other Common Microstrip Coupled‐Line Structures 2.8.3.1 Microstrip DC Break 2.8.3.2 Edge‐Coupled Microstrip Band‐Pass Filter 2.8.3.3 Lange Coupler 2.9 Summary 2.10 Supplementary Problems References Chapter 3 Fabrication Processes for RF and Microwave Circuits 3.1 Introduction 3.2 Review of Essential Material Parameters 3.2.1 Dielectrics 3.2.2 Conductors 3.3 Requirements for RF Circuit Materials 3.4 Fabrication of Planar High‐Frequency Circuits 3.4.1 Etched Circuits 3.4.2 Thick‐Film Circuits (Direct Screen Printed) 3.4.3 Thick Film Circuits (Using Photoimageable Materials) 3.4.4 Low‐Temperature Co‐Fired Ceramic Circuits 3.5 Use of Ink Jet Technology 3.6 Characterization of Materials for RF and Microwave Circuits 3.6.1 Measurement of Dielectric Loss and Dielectric Constant 3.6.1.1 Cavity Resonators 3.6.1.2 Dielectric Characterization by Cavity Perturbation 3.6.1.3 Use of the Split Post Dielectric Resonator (SPDR) 3.6.1.4 Open Resonator 3.6.1.5 Free‐Space Transmission Measurements 3.6.2 Measurement of Planar Line Properties 3.6.2.1 The Microstrip Resonant Ring 3.6.2.2 Non‐resonant Lines 3.6.3 Physical Properties of Microstrip Lines 3.7 Supplementary Problems References Chapter 4 Planar Circuit Design II 4.1 Introduction 4.2 Discontinuities in Microstrip 4.2.1 Open‐End Effect 4.2.2 Step‐Width 4.2.3 Corners 4.2.4 Gaps 4.2.5 T‐Junctions 4.3 Microstrip Enclosures 4.4 Packaged Lumped‐Element Passive Components 4.4.1 Typical Packages for RF Passive Components 4.4.2 Lumped‐Element Resistors 4.4.3 Lumped‐Element Capacitors 4.4.4 Lumped‐Element Inductors 4.5 Miniature Planar Components 4.5.1 Spiral Inductors 4.5.2 Loop Inductors 4.5.3 Interdigitated Capacitors 4.5.4 Metal–Insulator–Metal Capacitor References Chapter 5 S‐Parameters 5.1 Introduction 5.2 S‐Parameter Definitions 5.3 Signal Flow Graphs 5.4 Mason's Non‐touching Loop Rule 5.5 Reflection Coefficient of a Two‐Port Network 5.6 Power Gains of Two‐Port Networks 5.7 Stability 5.8 Supplementary Problems {5.A.1} Transmission Parameters (ABCD Parameters) {5.A.2} Admittance Parameters (Y‐Parameters) {5.A.3} Impedance Parameters (Z‐Parameters) References Chapter 6 Microwave Ferrites 6.1 Introduction 6.2 Basic Properties of Ferrite Materials 6.2.1 Ferrite Materials 6.2.2 Precession in Ferrite Materials 6.2.3 Permeability Tensor 6.2.4 Faraday Rotation 6.3 Ferrites in Metallic Waveguide 6.3.1 Resonance Isolator 6.3.2 Field Displacement Isolator 6.3.3 Waveguide Circulator 6.4 Ferrites in Planar Circuits 6.4.1 Planar Circulators 6.4.2 Edge‐Guided‐Mode Propagation 6.4.3 Edge‐Guided‐Mode Isolator 6.4.4 Phase Shifters 6.5 Self‐Biased Ferrites 6.6 Supplementary Problems References Chapter 7 Measurements 7.1 Introduction 7.2 RF and Microwave Connectors 7.2.1 Maintenance of Connectors 7.2.2 Connecting to Planar Circuits 7.3 Microwave Vector Network Analyzers 7.3.1 Description and Configuration 7.3.2 Error Models Representing a VNA 7.3.3 Calibration of a VNA 7.4 On‐Wafer Measurements 7.5 Summary References Chapter 8 RF Filters 8.1 Introduction 8.2 Review of Filter Responses 8.3 Filter Parameters 8.4 Design Strategy for RF and Microwave Filters 8.5 Multi‐Element Low‐Pass Filter 8.6 Practical Filter Responses 8.7 Butterworth (or Maximally Flat) Response 8.7.1 Butterworth Low‐Pass Filter 8.7.2 Butterworth High‐Pass Filter 8.7.3 Butterworth Band‐Pass Filter 8.8 Chebyshev (Equal Ripple) Response 8.9 Microstrip Low‐Pass Filter, Using Stepped Impedances 8.10 Microstrip Low‐Pass Filter, Using Stubs 8.11 Microstrip Edge‐Coupled Band‐Pass Filters 8.12 Microstrip End‐Coupled Band‐Pass Filters 8.13 Practical Points Associated with Filter Design 8.14 Summary 8.15 Supplementary Problems References Chapter 9 Microwave Small‐Signal Amplifiers 9.1 Introduction 9.2 Conditions for Matching 9.3 Distributed (Microstrip) Matching Networks 9.4 DC Biasing Circuits 9.5 Microwave Transistor Packages 9.6 Typical Hybrid Amplifier 9.7 DC Finger Breaks 9.8 Constant Gain Circles 9.9 Stability Circles 9.10 Noise Circles 9.11 Low‐Noise Amplifier Design 9.12 Simultaneous Conjugate Match 9.13 Broadband Matching 9.14 Summary 9.15 Supplementary Problems References Chapter 10 Switches and Phase Shifters 10.1 Introduction 10.2 Switches 10.2.1 PIN Diodes 10.2.2 Field Effect Transistors 10.2.3 Microelectromechanical Systems 10.2.4 Inline Phase Change Switch Devices 10.3 Digital Phase Shifters 10.3.1 Switched‐Path Phase Shifter 10.3.2 Loaded‐Line Phase Shifter 10.3.3 Reflection‐Type Phase Shifter 10.3.4 Schiffman 90° Phase Shifter 10.3.5 Single‐Switch Phase Shifter 10.4 Supplementary Problems References Chapter 11 Oscillators 11.1 Introduction 11.2 Criteria for Oscillation in a Feedback Circuit 11.3 RF (Transistor) Oscillators 11.3.1 Colpitts Oscillator 11.3.2 Hartley Oscillator 11.3.3 Clapp–Gouriet Oscillator 11.4 Voltage‐Controlled Oscillator 11.5 Crystal‐Controlled Oscillators 11.5.1 Crystals 11.5.2 Crystal‐Controlled Oscillators 11.6 Frequency Synthesizers 11.6.1 The Phase‐Locked Loop 11.6.1.1 Principle of a Phase‐Locked Loop 11.6.1.2 Main Components of a Phase‐Locked Loop 11.6.1.3 Gain of Phase‐Locked Loop 11.6.1.4 Transient Analysis of a Phase‐Locked Loop 11.6.2 Indirect Frequency Synthesizer Circuits 11.7 Microwave Oscillators 11.7.1 Dielectric Resonator Oscillator 11.7.2 Delay‐Line Stabilized Microwave Oscillators 11.7.3 Diode Oscillators 11.7.3.1 Gunn Diode Oscillator 11.7.3.2 IMPATT Diode Oscillator 11.8 Oscillator Noise 11.9 Measurement of Oscillator Noise 11.10 Supplementary Problems References Chapter 12 RF and Microwave Antennas 12.1 Introduction 12.2 Antenna Parameters 12.3 Spherical Polar Coordinates 12.4 Radiation from a Hertzian Dipole 12.4.1 Basic Principles 12.4.2 Gain of a Hertzian Dipole 12.5 Radiation from a Half‐Wave Dipole 12.5.1 Basic Principles 12.5.2 Gain of a Half‐Wave Dipole 12.5.3 Summary of the Properties of a Half‐Wave Dipole 12.6 Antenna Arrays 12.7 Mutual Impedance 12.8 Arrays Containing Parasitic Elements 12.9 Yagi–Uda Antenna 12.10 Log‐Periodic Array 12.11 Loop Antenna 12.12 Planar Antennas 12.12.1 Linearly Polarized A linearly polarized antenna is one where the direction of the radiated electric field remains fixed as the wave propagates. Patch Antennas 12.12.2 Circularly Polarized Planar Antennas 12.13 Horn Antennas 12.14 Parabolic Reflector Antennas 12.15 Slot Radiators 12.16 Supplementary Problems References Chapter 13 Power Amplifiers and Distributed Amplifiers 13.1 Introduction 13.2 Power Amplifiers 13.2.1 Overview of Power Amplifier Parameters 13.2.1.1 Power Gain 13.2.1.2 Power Added Efficiency 13.2.1.3 Input and Output Impedances 13.2.2 Distortion 13.2.2.1 Gain Compression 13.2.2.2 Third‐Order Intercept Point 13.2.3 Linearization 13.2.3.1 Pre‐Distortion 13.2.3.2 Negative Feedback 13.2.3.3 Feed‐Forward Linearization 13.2.4 Power Combining 13.2.5 Doherty Amplifier 13.3 Load Matching of Power Amplifiers 13.4 Distributed Amplifiers 13.4.1 Description and Principle of Operation 13.4.2 Analysis 13.5 Developments in Materials and Packaging for Power Amplifiers References Chapter 14 Receivers and Sub‐Systems 14.1 Introduction 14.2 Receiver Noise Sources 14.2.1 Thermal Noise 14.2.2 Semiconductor Noise 14.3 Noise Measures 14.3.1 Noise Figure (F) 14.3.2 Noise Temperature (Te) 14.4 Noise Figure of Cascaded Networks 14.5 Antenna Noise Temperature 14.6 System Noise Temperature 14.7 Noise Figure of a Matched Attenuator at Temperature TO 14.8 Superhet Receiver 14.8.1 Single‐Conversion Superhet Receiver 14.8.2 Image Frequency 14.8.3 Key Figures of Merit for a Superhet Receiver 14.8.4 Double‐Conversion Superhet Receiver 14.8.5 Noise Budget Graph for a Superhet Receiver 14.9 Mixers 14.9.1 Basic Mixer Principles 14.9.2 Mixer Parameters 14.9.3 Active and Passive Mixers 14.9.4 Single‐Ended Diode Mixer 14.9.5 Single Balanced Mixer 14.9.6 Double Balanced Mixer 14.9.7 Active FET Mixers 14.10 Supplementary Problems {14.A.1} Error Function Table {14.A.2} Measurement of Noise Figure {14.A.2} Y‐factor method {14.A.2} Noise diode method {14.A.2} Discharge tube method References Answers to Selected Supplementary Problems Index EULA
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