Photoelectric Materials and Devices
- Length: 496 pages
- Edition: 1
- Language: English
- Publisher: World Scientific Publishing Company
- Publication Date: 2021-06-03
- ISBN-10: 9811230609
- ISBN-13: 9789811230608
- Sales Rank: #0 (See Top 100 Books)
This book mainly introduces the basic theory and physical characteristics of photoelectric materials, the preparation technology of photoelectric components, the working principle, the latest application, the latest progress of photoelectric materials and devices technology and the correlation with other technologies. The content mainly involves the theoretical basis of photoelectric materials, micro-nano photoelectric materials and devices, semiconductor luminescent materials and devices, inorganic photoluminescence materials, LED packaging technology, transparent conductive materials, touch screen, display screen, solar cell materials and the basic principles and development trend of their applications. In particular, the book gives a systematic theoretical analysis of new photoelectric materials and devices, such as optoelectronic materials and devices, transparent conductive materials, and provides application examples.
Contents Profile Preface Chapter 1. Introduction 1.1. Brief Introduction of Photoelectronics Technology 1.1.1. Development course of optoelectronics technology 1.1.2. Related concepts of optoelectronic technology 1.2. The Concept, Position and Function of Photoelectric Materials and Devices 1.2.1. Basic concepts of photoelectric materials and devices 1.2.2. The position and function of photoelectric materials and devices in photoelectric technology 1.3. The Theoretical Basis of This Book 1.3.1. Photoelectric conversion materials and devices 1.3.2. Electro-optical conversion materials and devices 1.3.3. Transparent conductive material References Chapter 2. Theoretical Basis of Photoelectric Materials 2.1. Energy Band Theory 2.1.1. Schrödinger equation of crystal and its approximate solution 2.1.1.1. Schrödinger equation 2.1.1.2. Adiabatic approximation and atomic valence approximation 2.1.1.3. Single-electron approximation — Hartree–Fock method 2.1.1.4. Atomic orbits and lattice orbits 2.1.1.5. State distribution of electrons 2.1.2. Bloch’s theorem 2.1.3. Periodic boundary conditions 2.1.4. Energy bands and their general properties 2.1.4.1. Energy band 2.1.4.2. General characteristics of energy bands 2.1.5. Brillouin zone 2.1.5.1. Brillouin Zoning method 2.1.5.2. Characteristics of Brillouin region 2.1.5.3. Simple Brillouin zone 2.1.6. Metals, semiconductors and insulators 2.1.6.1. Full-filled band and partially-filled band 2.1.6.2. Metals, semiconductors and insulators 2.1.7. Electrons, holes and carriers 2.2. The Process of Absorption in a Material 2.2.1. The basic absorption 2.2.2. Direct transition of permission and prohibition 2.2.2.1. Permissible direct transitions 2.2.2.2. The direct transition of prohibition 2.2.3. Indirect transition 2.2.4. Exciton 2.3. The Photoelectric Effect 2.3.1. External photoelectric effect 2.3.1.1. Stoletov’s law 2.3.1.2. Einstein’s law 2.3.1.3. Red limit of photoelectric emission 2.3.1.4. Instantaneous photoelectric emission 2.3.1.5. Photoelectric emission of metals 2.3.1.6. Photoelectric emission of semiconductors 2.3.2. Photoconductive effect 2.3.2.1. The relationship between photoconductivity and light intensity under constant illumination 2.3.2.2. Relaxation time of photoconductivity 2.3.2.3. Photoresistors 2.3.3. Photovoltage 2.3.3.1. Open-circuit voltage and short-circuit current 2.3.3.2. Composition of photocurrent Il 2.3.3.3. Photovoltaic equivalent circuit with load 2.3.4. Thermoelectric effect 2.3.5. Pyroelectric effect 2.3.6. Photon traction effect References Chapter 3. Micro/Nano Photoelectric Materials and Devices 3.1. Nanometer Photoelectric Materials and Devices 3.1.1. Nano photoelectric materials 3.1.1.1. Nano-luminescent materials 3.1.1.2. Nano photoelectric conversion materials 3.1.1.3. Nano-photocatalytic materials 3.1.2. Nanometer photoelectric devices 3.1.2.1. Quantum dot optoelectronic devices 3.1.2.2. Nanowire optoelectronic devices 3.2. Photonic Crystals and Photonic Crystal Devices 3.2.1. Structure of photonic crystals 3.2.2. Basic properties of photonic crystals 3.2.2.1. Photonic crystal forbidden band 3.2.2.2. Abnormal dispersion 3.2.2.3. Inhibition and enhancement of spontaneous radiation 3.2.3. Photonic crystal devices 3.2.3.1. Photonic crystal fibers 3.2.3.2. Photonic crystal light-emitting diodes 3.2.3.3. Photonic crystal lasers 3.3. Metamaterials and Related Devices 3.3.1. Metamaterials 3.3.2. Negative refractive index materials and devices 3.3.2.1. Physical properties of negative refractive index materials 3.3.2.2. Typical structure of negative refractive index materials 3.3.2.3. Negative refractive index device — superlens 3.3.3. Stealth cloak 3.4. Surface Plasmon Polaritons and Devices 3.4.1. Basic principles and properties 3.4.2. Surface plasmon optical waveguide 3.4.3. Surface plasmon resonance sensor References Chapter 4. Semiconductor Luminescent Materials and Devices 4.1. Introduction to Semiconductor Luminescent Materials Crystals 4.1.1. Crystal structure 4.1.1.1. Spatial lattice 4.1.1.2. Crystal plane and orientation 4.1.2. Defects and their effects on luminescence 4.1.3. Energy band structure 4.1.4. Conditions of semiconductor luminescent materials 4.2. Absorption of Light by Semiconductors 4.2.1. Classification of light absorbing mechanisms in semiconductors 4.2.2. Semiconductor optical absorption theory 4.2.2.1. Light absorption coefficient 4.2.2.2. Characteristics of interband absorption spectrum curve 4.2.2.3. A simple description of the interband absorption spectrum curve 4.3. Excitation and Luminescence of Semiconductors 4.3.1. PN junction and its characteristics 4.3.1.1. Reverse breakdown 4.3.1.2. Unidirectional electricity 4.3.1.3. Volt–ampere characteristics 4.3.1.4. Capacitance characteristics 4.3.2. Recombination of injected carriers 4.3.2.1. Radiative compound 4.3.2.2. Non-radiative composition 4.4. Light-Emitting Diode Lighting Technology 4.4.1. Basic characteristics of LED 4.4.1.1. Basic structure of LED 4.4.1.2. Symbols of LED in electronic circuits 4.4.2. LED luminescence principle 4.4.2.1. Luminescence conditions for manufacturing light-emitting diodes 4.4.2.2. White light mode of light-emitting diodes 4.4.2.3. Basic characteristics of light-emitting diodes 4.4.3. Characteristic parameters of LED 4.4.3.1. Electrical characteristics of LED 4.4.3.2. Optical properties of LED 4.4.3.3. Thermal characteristics 4.4.4. LED driving technology 4.4.4.1. Commonly used LED driving mode 4.4.4.2. Load connection mode 4.4.4.3. Characteristics of LED driving technology 4.4.5. LED application 4.4.5.1. Building exterior lighting 4.4.5.2. Landscape lighting 4.4.5.3. Marking and indicative lighting 4.4.5.4. Interior space display lighting 4.4.5.5. Entertainment places and stage lighting 4.4.5.6. Vehicle indicator lighting 4.5. Photoluminescence and Electroluminescence of Organic Materials 4.5.1. Photoluminescence principle of organic materials 4.5.2. Relation between molecular structure and luminescence properties 4.5.3. Luminescence quenching phenomenon 4.5.4. Application of organic photoluminescent materials 4.5.5. Structure and luminescence principle of organic electroluminescent materials 4.5.6. Advantages of organic electroluminescent materials 4.5.7. Main problems of organic electroluminescent materials 4.5.8. Future development trends of organic electroluminescent materials References Chapter 5. Inorganic Photoluminescent Materials 5.1. Inorganic Photoluminescence 5.1.1. Photoluminescence process 5.1.2. Light return to ground state: luminescence 5.1.2.1. Excitation process 5.1.2.2. Energy transfer process 5.1.2.3. Luminescence process 5.1.3. Non-radiative return to ground state 5.2. Luminescence Principle of Phosphor 5.2.1. Basic concepts 5.2.1.1. Luminescence center 5.2.1.2. Emission spectrum 5.2.1.3. Excitation spectra 5.2.1.4. Absorption spectra 5.2.1.5. Luminescence attenuation 5.2.1.6. Luminescence efficiency 5.2.2. Characteristics of phosphors 5.2.2.1. Primary properties of phosphors (test performance) 5.2.2.2. Quadratic properties of phosphors (performance) 5.2.2.3. Factors determining the conversion efficiency of phosphors 5.3. Development History and Present Situation of Phosphors 5.3.1. Development history of fluorescent powders for fluorescent lamps 5.3.1.1. First generation phosphors (1938–1948) 5.3.1.2. Second generation phosphors (1949–) 5.3.1.3. Rare earth phosphors 5.3.2. Rare earth tribasic phosphor 5.3.3. White LED phosphor 5.3.3.1. Problems of LED phosphors 5.3.3.2. Development trend and application requirements of white LED phosphors 5.4. Main Preparation Methods of Phosphors 5.4.1. High-temperature solid-phase method 5.4.2. Combustion synthesis method 5.4.3. Solvent (hydrothermal) method 5.4.4. Sol–gel method 5.4.4.1. Basic principles of sol–gel method 5.4.4.2. Basic process of sol–gel method 5.4.4.3. Characteristics of sol–gel method 5.4.5. Precipitation method 5.4.6. Spray pyrolysis 5.4.7. Microemulsion method 5.4.8. Polymer network gel method 5.4.9. Microwave method References Chapter 6. Light-Emitting Diode Packaging Technology 6.1. LED Packaging Mode 6.1.1. Pin package 6.1.2. Surface mount packaging 6.1.3. Power package 6.1.4. Integrated multichip device packaging 6.1.5. Other packaging methods 6.1.5.1. Flip-chip LED package 6.1.5.2. LED filament 6.2. LED Packaging Technology 6.3. LED Packaging Materials and Equipment 6.3.1. LED packaging material 6.3.1.1. Bracket (substrate) 6.3.1.2. Packaging glue 6.3.1.3. Conductive adhesive 6.3.1.4. Golden thread 6.3.1.5. Phosphors 6.3.2. LED packaging equipment 6.3.2.1. Metallographic microscope 6.3.2.2. Wafer expander 6.3.2.3. Dispenser 6.3.2.4. Backing glue machine 6.3.2.5. Crystallizer 6.3.2.6. Wire welder 6.3.2.7. Glue-filling machine 6.3.2.8. Oven 6.3.2.9. Other equipment 6.4. Fluorescent Powder Coating Technology 6.4.1. Mix phosphor powder 6.4.1.1. Glue selection 6.4.1.2. Preparation of suspension 6.4.2. Phosphor coating 6.5. LED Heat Dissipation Technology 6.5.1. Source of heat 6.5.2. Effect of heat on LED 6.5.3. Heat dissipation mechanism and solution of LED 6.5.3.1. Heat dissipation mechanism 6.5.3.2. Solution to heat dissipation problem 6.5.3.3. Refrigeration devices 6.6. Optical Structure of LED 6.6.1. LED light conversion structure 6.6.2. LED light distribution structure 6.6.3. Simulation and design of LED packaging 6.7. Key Technology of Power LED Packaging 6.7.1. Ways to improve luminous efficiency 6.7.2. Improving the optical characteristics of LED 6.7.3. Increase the single light flux and input power of LED 6.7.4. Reduce the cost of LED 6.7.5. Improving the reliability of LED References Chapter 7. Transparent Conductive Materials 7.1. Brief Introduction of Transparent Conductive Films 7.2. Typical TCO Materials 7.3. Conductivity of TCO 7.3.1. Conductivity principle of TCO 7.3.2. Energy band, orbital domain and mobility 7.3.3. N-type and P-type TCO 7.3.4. Carrier generation 7.3.5. The relation between the conductivity of TCO and temperature and carrier concentration 7.3.6. Relation between carrier scattering and resistance in TCO 7.4. Optical Properties of TCO 7.4.1. Transparency principle of TCO 7.4.2. Plasma vibration and plasma frequency 7.4.3. Burstein–Moss effect 7.4.4. Carrier concentration and transparency 7.5. Transparent Conductive Material Technology 7.5.1. Indium tin oxide 7.5.2. Other compromises between conductivity and transparency 7.5.3. Soft ITO films 7.5.4. Silver nanowires References Chapter 8. Touch Panel 8.1. Development of Touch Technology 8.1.1. The generation of touch control technology 8.1.2. Definition of touch panel 8.1.2.1. Transparency 8.1.2.2. Touch panel is absolute coordinate system 8.1.2.3. Detecting touch and locating 8.1.3. Classification of touch panel 8.2. Resistance Touch Panel 8.3. Capacitance Touch Panel 8.3.1. Surface capacitance touch panel 8.3.2. Projection capacitive touch panel 8.3.2.1. Self-capacitive touch panel 8.3.2.2. Mutual capacitance touch panel 8.4. Other Touch Technology 8.4.1. Infrared touch panel technology 8.4.2. Surface acoustic wave touch panel 8.5. The Frontier of Touch Control Technology 8.5.1. Embedded touch panel 8.5.1.1. OGS technology 8.5.1.2. On cell technology 8.5.1.3. In cell technology 8.5.1.4. Hybrid in cell technology 8.5.2. Force touch technology 8.5.3. Flexible touch technology 8.6. Introduction of Touch Panel Production Technology 8.6.1. Production technology of glass touch panel 8.6.1.1. Process of shading layer 8.6.1.2. ITO process 8.6.1.3. OG process 8.6.1.4. Metal processing 8.6.1.5. Processing of SiO2 protective layer 8.6.1.6. Peelable rubber processing 8.6.1.7. Cutting process 8.6.1.8. CNC process 8.6.1.9. Secondary intensification process 8.6.1.10. FPC process 8.6.2. Production technology of film touch panel 8.6.2.1. Aging 8.6.2.2. Acid-resistant ink printing 8.6.2.3. Etching and cleaning 8.6.2.4. Silver paste printing 8.6.2.5. OCA fit 8.6.2.6. Punching 8.6.2.7. FPC binding 8.6.2.8. CG Combination 8.6.3. Yellow light process for film touch panel 8.6.3.1. Photoresist bonding 8.6.3.2. Exposure development 8.7. Capacitive Touch Panel Production Equipment and Materials 8.7.1. Major production equipment of capacitive touch panel 8.7.2. Capacitive touch panel manufacturing auxiliary materials 8.7.2.1. Silver paste 8.7.2.2. OCA 8.7.2.3. ACF/ACA References Chapter 9. Display Screen 9.1. Introduction of Display Technology 9.2. Working Principle and Characteristic of Display 9.2.1. Cathode ray tube (CRT) display 9.2.2. Liquid crystal display 9.2.3. Plasma display 9.2.4. Organic electroluminescent display 9.2.5. LED display 9.2.6. Organic Light Emitting Diode (OLED) display 9.3. Structure and Working Principle of TFT-LCD Device 9.3.1. Liquid crystal materials and their properties 9.3.2. Structure and working principle of panel plate 9.3.2.1. Twisted nematic LCD 9.3.2.2. Thin-film transistor liquid crystal display 9.3.3. Structure and principle of backlight 9.3.3.1. Classification of backlight sources and construction of lamp tubes 9.3.3.2. Construction of backlight 9.4. Material Technology and Technology of TFT-LCD 9.4.1. TFT-LCD material technology 9.4.1.1. Glass substrate 9.4.1.2. ITO thin-films 9.4.1.3. Directional membranes 9.4.1.4. Liquid crystal materials 9.4.1.5. CF substrate 9.4.1.6. Polarizer 9.4.1.7. Backlight 9.4.2. TFT-LCD technology 9.4.2.1. Manufacturing process of thin-film transistor (TFT) 9.4.2.2. Cell/screen making process 9.5. OLED Display Screen 9.5.1. Principle and application of OLED display 9.5.2. Fabrication of OLED devices 9.5.2.1. Fabrication of OLED thin-films 9.5.2.2. Packaging and passivation of OLED devices 9.5.3. Advantages and disadvantages of OLED 9.5.3.1. Advantages of OLED 9.5.3.2. Disadvantages of OLED 9.5.4. Driving mode of OLED 9.5.4.1. Passive driver 9.5.4.2. Active driver 9.5.5. Challenges for OLED industry References Chapter 10. Materials and Applications of Solar Cells 10.1. Photovoltaic Technology and Solar Cells 10.1.1. Development of solar cells 10.1.1.1. Development of international solar cell technology 10.1.1.2. Domestic solar cell technology development 10.1.2. Principle of solar cell 10.1.2.1. Electron and hole transport 10.1.2.2. Doping characteristics of semiconductors 10.1.2.3. Working principle and structure of solar cells 10.1.3. Classification of solar cells 10.2. Crystalline Silicon Solar Cells 10.2.1. Polycrystalline silicon thin-film solar cells 10.2.2. Amorphous silicon thin-film solar cells 10.3. Compound Semiconductor Thin-Film Batteries 10.3.1. CdTe solar cells 10.3.1.1. CdTe solar cell structure 10.3.1.2. Fabrication technology of CdTe solar cells 10.3.1.3. Advantages and disadvantages of CdTe solar cells 10.3.2. CIGS solar cells 10.3.2.1. Structure and material properties of CIGS thin-film solar cells 10.3.2.2. Advantages of CIGS Technology 10.3.3. GaAs solar cells 10.3.3.1. Structure of GaAs solar cells 10.3.3.2. Fabrication technology of GaAs thin-films 10.4. New Solar Cells 10.4.1. Dye-sensitized solar cells 10.4.1.1. Structure of dye-sensitized solar cells 10.4.1.2. Principle of dye-sensitized solar cells 10.4.1.3. Advantages of dye-sensitized solar cells 10.4.1.4. Problems and development prospects of dye-sensitized solar cells 10.4.2. Organic thin-film solar cells 10.4.2.1. Structure of organic solar cells 10.4.2.2. Common materials for organic solar cells 10.4.3. Perovskite solar cells 10.4.3.1. Perovskite material structure 10.4.3.2. Typical battery structure of perovskite batteries 10.4.3.3. Principle of perovskite battery group References
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