Complete PCB Design Using OrCAD Capture and PCB Editor, 2nd Edition
- Length: 612 pages
- Edition: 2
- Language: English
- Publisher: Academic Press
- Publication Date: 2019-07-05
- ISBN-10: 0128176849
- ISBN-13: 9780128176849
- Sales Rank: #990504 (See Top 100 Books)
Complete PCB Design Using OrCAD Capture and PCB Editor, Second Edition, provides practical instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. Chapters cover how to Design a PCB using OrCAD Capture and OrCAD PCB Editor, adding PSpice simulation capabilities to a design, how to develop custom schematic parts, how to create footprints and PSpice models, and how to perform documentation, simulation and board fabrication from the same schematic design. This book is suitable for both beginners and experienced designers, providing basic principles and the program’s full capabilities for optimizing designs.
Cover Complete PCB Design Using OrCAD® Capture and PCB Editor Copyright Acknowledgments Introduction 1 Introduction to printed circuit board design and computer-aided design Computer-aided design and the OrCAD design suite Printed circuit board fabrication Printed circuit board cores and layer stack-up Printed circuit board fabrication process Photolithography and chemical etching Mechanical milling Layer registration Function of OrCAD PCB Editor in the printed circuit board design process Design files created by PCB Editor PCB Editor format files Artwork (Gerber) files Printed circuit board assembly layers and files 2 Introduction to the printed circuit board design flow by example Overview of the design flow Creating a circuit design with Capture Starting a new project Placing parts Wiring (connecting) the parts Creating the PCB Editor netlist in Capture Designing the printed circuit board with PCB Editor The PCB Editor Window Controlling the view Drawing the board outline Placing parts Moving and rotating parts Routing the board Using the autorouter Manual routing Performing a design rule check Creating artwork for manufacturing 3 Project structures and the PCB Editor tool set Project setup and schematic entry details Capture projects explained Capture part libraries explained Understanding the PCB Editor environment and tool set Terminology PCB Editor windows and tools The design window The toolbar groups Application mode group Edit group View group Setup group Shapes group Manufacture group Display group Miscellaneous group Place group Route group Add group Control panel with foldable window panes Visibility pane Find filter pane Options pane Command window pane World view window pane Status bar Color and visibility dialog box Cross-section Editor (layer stack-up) dialog box Constraint manager Padstack editor Manufacturing artwork and drill files Understanding the documentation files 4 Introduction to industry standards Introduction to the standards organizations IPC—Association Connecting Electronics Industries Electronic Industries Alliance JEDEC Solid State Technology Association International Electrotechnical Commission Military standards American National Standards Institute Institute of Electrical and Electronics Engineers Classes and types of printed circuit boards Performance classes Producibility levels Fabrication types and assembly subclasses IPC land pattern density levels Introduction to standard fabrication allowances Registration tolerances Breakout and annular ring control Printed circuit board dimensions and tolerances Standard panel sizes Tooling area allowances and effective panel usage Standard finished printed circuit board thickness Core thickness Prepreg thickness Copper thickness for plated through holes and vias Copper cladding/foil thickness Copper trace and etching tolerances Standard hole dimensions Soldermask tolerance References Further reading 5 Introduction to design for manufacturing Introduction to printed circuit board assembly and soldering processes Assembly processes Manual assembly processes Automated assembly processes (pick and place) Soldering processes Manual soldering Wave soldering Reflow soldering Component placement and orientation guide Component spacing for through-hole devices Discrete through-hole devices Integrated circuit through-hole devices Mixed discrete and integrated circuit through-hole devices Holes and jumper wires Component spacing for surface-mounted devices Discrete surface-mount devices Integrated circuit surface-mount devices Mixed discrete and integrated circuit surface-mount devices Mixed through-hole devices and surface-mounted devices spacing requirements Footprint and padstack design for printed circuit board manufacturability Land patterns for surface-mounted devices Surface-mounted device padstack design Surface-mounted devices footprint design Land patterns for through-hole devices Footprint design for through-hole devices Padstack design for through-hole devices Hole-to-lead ratio Plated through hole land dimension (annular ring width) Clearance between plane layers and plated through holes Soldermask and solder paste dimensions References 6 PCB design for signal integrity Circuit design issues not related to PCB layout Noise Background noise Intrinsic noise Distortion Frequency response Issues related to PCB layout Electromagnetic interference and cross talk Magnetic fields and inductive coupling Loop inductance Electric fields and capacitive coupling Ground planes and ground bounce What Ground is and what it is not Ground (return) planes Ground bounce and rail collapse Split power and ground planes PCB electrical characteristics Characteristic impedance Reflections Ringing Electrically long traces Critical length Transmission line terminations PCB routing topics Parts placement for electrical considerations PCB layer stack-up Bypass capacitors and fan-out Trace width for current-carrying capability Trace width for controlled impedance Topologies, Z0, TPD, trace width, and trace separation design equations for various transmission lines Trace spacing for voltage withstanding Trace spacing to minimize cross talk (3w rule) Traces with acute and 90 degree angles Using PSpice to simulate transmission lines Simulating digital transmission lines Simulating analog signals References 7 Making and editing Capture parts The Capture part libraries Types of packaging Homogeneous parts Heterogeneous parts Pins Part editing tools The Select tool and Settings Select tool Snap to Grid Area Select method Drag connected object mode The Pin tools Place Pin tool Place Pin Array tool The Graphics tools Place IEEE Symbol Place Line tool Place Polyline tool Place Rectangle tool Place Ellipse tool Place Text tool Place Elliptical Arc tool Place Bezier Curve tool Place Picture tool The Zoom tools Zoom In Zoom Out Zoom to Region Zoom to All Methods of constructing Capture parts Method 1. Constructing parts using the New Part option (Design menu) Design example for a passive, homogeneous part Design example for an active, multipart, and homogeneous component Assigning power pin visibility Design example for a passive, heterogeneous part Method 2. Constructing parts with Capture using the Design Spreadsheet Method 3. Generating or copying the schematic symbols from other sources Method 4. Generating parts with the PSpice Model Editor Generating a Capture Part Library from a PSpice Model Library Making and/or obtaining PSpice libraries for making New Capture parts Downloading libraries and/or models from the Internet Making a PSpice Model from a Capture project Adding PSpice templates (models) to preexisting Capture parts Constructing Capture symbols 8 Making and editing footprints Introduction to PCB Editor’s symbols library Symbol types Composition of a footprint Padstacks Graphical objects Text Minimum footprint requirements Optional footprint objects Introduction to the Padstack Editor Start tab Drill tab Secondary Drill tab Drill Symbol tab Drill Offset tab Design Layers tab Mask Layers tab Options tab Footprint design examples Example 1. Design of a through-hole device from scratch Designing the through-hole padstack Designing a through-hole footprint symbol Controlling text size Example 2. Design of surface-mount device from an existing symbol Modifying an existing symbol: determining design requirements Replacing a padstack definition Example 3. PGA or BGA package design using the Symbol Wizard Flash symbols for thermal reliefs Mechanical symbols Mounting holes Creating mechanical symbol drawings Placing mechanical symbols on a board design Blind, buried, and microvias OrCAD Library Builder 3D canvas Bending the rigid-flex printed circuit board in 3D canvas References 9 Printed circuit board design examples Introduction Overview of the design flow Example 1. Dual power supply, analog design Initial design concept and preparation Setting up the project in Capture Drawing the schematic with Capture Placing parts Connect parts with wires (signal nets) Making power and ground connections Preparing the design for PCB Editor Grouping related components (rooms) Annotation Cleanup Cache Performing a schematic design rule check in Capture Generating the netlist for PCB Editor Problems during netlist creation Setting up the board Setting up the extents (work area boundary) Controlling the Grid Making a board outline Adding dimension measurements Adding mounting holes Placing parts Intertool communication Using cross-probing to place parts Rotating parts Mirroring parts Changing a part in capture Performing an engineering change order Controlling layer visibility Controlling net visibility Cross-highlighting between Capture and PCB Editor Finding parts using the Find filter pane Design rule check and status Using the Status dialog box Generating design rule check reports Design rule check error markers Defining the layer stack-up Setting up the Layout Cross Section Pouring copper planes Pouring a copper plane using the setup → Outlines Option Pouring a copper plane using the Shape Add Tool Verifying connectivity between Pins and Planes Adding thermal reliefs and clearances to padstacks Defining trace width and spacing rules Determining trace width Assigning vias Determining trace spacing requirements Prerouting the board Routing fan-outs for power and ground Moving and deleting fan-outs Manually routing traces To begin manually routing traces Locking (fixing) traces Running the autorouter Finalizing the design Postrouting inspection Checking routing statistics Cleaning up a design by glossing Synchronizing the design with Capture (back annotation) Example 2. Mixed analog/digital design using split power, Ground planes Mixed-signal circuit design in Capture Power and ground connections to digital and analog parts Connecting separate analog and digital grounds to a split plane Using buses for digital nets Defining the layer stack-up for split planes Defining the layer stack-up Setting up a split GND Plane Setting up separate planes on a single plane layer Setting up routing constraints Adding Route Keep-Out areas Moving a routed trace to a different layer Adding Ground Planes and guard traces to Routing layers Routing guard traces and rings Adding Ground planes to Routing layers Example 3. Multipage, multipower, and multiground mixed A/D printed circuit board design with PSpice Introduction Multiplane layer methodologies Capture project setup for PSpice simulation and board design Adding schematic pages to the design Using off-Page connectors with wires Using off-page connectors with buses Setting up multiple ground systems on the schematic Setting up PSpice sources Performing PSpice simulations Designing the board with PCB Editor Create the board outline Placing parts on the bottom (back) of a board Layer stack-up for a multiground system Adding copper to the planes Establishing net, plane, and constraint relationships Defining blind vias Basic overview of using Padstack Editor Assigning vias to nets Assigning nets to layers using custom, physical constraints Fan-outs using blind vias Alternate methods of connecting separate Ground planes Shorting the planes with copper etch Shorting the planes with a Padstack Example 4. High-speed digital design Layer setup for microstrip transmission lines Constructing a heat spreader with copper pours and vias Via design for heat spreaders Determining critical trace length of transmission lines Routing controlled impedance traces Maximum neck length Moated ground areas for clock circuits Routing curved traces Gate and pin swapping Using swap options Pin swapping Function (gate) swapping Back Annotating the swap operations to Capture Using the Autoswap option Autoswapping an entire design Autoswapping a Room Autoswapping a window selection Viewing the swap list and the swap log Defining a route keep-out area Positive planes Positive plane artwork production Positive versus negative plane file sizes Pros and cons of using positive versus negative planes Design templates Making a custom Capture template Making a custom PCB Editor board template Making a custom PCB Editor technology template Using the board wizard Moving on to manufacturing References Further reading 10 Artwork development and board fabrication Schematic design in Capture The board design with PCB Editor Routing the board Placing mechanical symbols Mechanical symbols for mounting holes Mechanical symbols for fiducials Generating manufacturing data Generating the artwork Adding a photoplot outline Optional artwork items Generating the artwork files Artwork control form General parameters Film control Adding elements to the artwork control form Generating drill files Drill file format Manually generating a tool list Generating route path files Establishing an NC route tool list file Cut marks Drawing the cut path Generating the route file Verifying the artwork Using CAD tools to 3D model the printed circuit board design Fabricating the board Fabricated PCB inspection and testing Generating pick and place files References 11 Component information system Introduction Properties in component information system Reserved properties Transfer component information system properties to PCB Editor Component information system administration Database systems Connection of database and component information system The settings file CAPTURE.INI The database configuration file Database configuration file—Part Database tab Database configuration file—Administrative Preferences tab Database configuration file—Relational Database tab Component information system and PSpice Ideal R, L, and C C and L with parasitics Association of schematic part with PSpice model Homogeneous parts and PSpice Heterogeneous parts and PSpice Schematic parts with more pins than the PSpice model How to simulate a project designed for both printed circuit board design and simulation? Working with component information system Find and place parts Part Manager Customize Part Manager Part Manager features Bill of materials Variants 12 Signal integrity simulation with OrCAD What is signal integrity? How to simulate in OrCAD Signal Explorer Prelayout simulation Postlayout simulation (verification) How to use OrCAD PCB SI tool Getting started Scheduling a topology Electrical rule checks in OrCAD Sigrity ERC Setup Graphical reports Appendix A List of design standards ANSI standards ASME standards IEEE standards IPC standards JEDEC standards Military standards Appendix B Partial list of packages and footprints and some of the footprints included in OrCAD PCB Editor Appendix C Rise and fall times for various logic families Appendix D Drill and screw dimensions Appendix E References by subject Component package types and mounting (surface-mounted device) Component placement, spacing, and orientation General considerations Capacitors/Bypassing/Placement Fiducials Wave soldering considerations Design rule checking Land patterns (footprint design) Surface-mounted device Through-hole Layer stack-ups Lead relationships Lead-to-hole ratio Lead bend radius and spacing Materials Copper Prepreg/Laminate Plating Solder Dielectric (relative permittivity) properties Mounting hardware and specifications PCB Fabrication Fabrication allowances Borders General design information Performance classes Assembly types Density levels Producibility levels Power distribution concepts Sizes/Panels Testing Plated through holes Types: Through, blind, buried, mounting holes Fabrication of through holes Aspect ratio Lead-to-hole ratio Hole-to-land ratio Land requirements Annular ring requirements Clearance from planes Nonfunctional lands Unsupported holes Fan-outs Via (through-hole) guidelines and fabrication Filled/Plugged holes Rise and fall times of logic families Schematics Symbols Diagrams Signal integrity Cross talk Ground bounce/rail collapse Propagation speed/time delay Reflections/Ringing Guard rings and traces Terminations Ground areas (split planes, moated grounds) Guard shields Noise reduction (general) EMI/EMC Soldering and assembly Assembly issues and processes Reflow soldering Wave soldering Components, placing/spacing Components, orientation Components, mounting Reliability Thermal management Trace routing Trace spacing (voltage withstanding) Trace spacing (cross talk/3-W rule) Trace width—current handling Trace width—transmission lines Microstrip Embedded microstrip Stripline Asymmetric stripline Transmission lines Characteristic impedance (microstrip, stripline topologies, etc.) Critical length Propagation delay time Reflections/Impedance mismatches Sharp corners Index Back Cover
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