Bogatin’s Practical Guide to Prototype Breadboard and PCB Design
- Length: 635 pages
- Edition: 1
- Language: English
- Publisher: Artech House
- Publication Date: 2021-09-30
- ISBN-10: B09LNYH138
- Sales Rank: #590216 (See Top 100 Books)
Printed circuit boards (PCB) are at the heart of every electronic product manufactured today. Yet, engineers rarely learn to design PCBs from a class or course. They learn it by doing, by reading app notes, watching YouTube videos and sitting by the side of an experienced engineer.
This book is the foundation building book for all engineers starting out to design PCBs. It teaches good habits designing a PCB, first for connectivity, and secondly, introduces the four most important principles to reduce noise.
A seven-step process is presented: developing a plan of record, creating a Bill of Materials, completing the schematic, completing the layout, completing the assembly, conducting bring up and troubleshooting and documenting the project. Each step is developed in detail. In particular, the emphasis in this book is on risk management: what can be done at each step of the process to reduce the risk of a hard-error which requires a complete re-spin, or a soft error, which requires some sort of on-the-fly repair.
After connectivity is designed, it’s important to develop good habits to minimize the potential noise from ground bounce, power rail stitching noise, stack up design and reducing switching noise in signal paths. These techniques apply to all designs from 2-layer to 8-layer and more, for bandwidths below 200 MHz.
The best practices for manual lead-free soldering are presented so that everyone can become a soldering expert.
The best measurement practices using common lab instruments such as the DMM, the constant current/constant voltage power supply, and oscilloscopes are presented so that common artifacts are minimized. Features in the design that help you find design or assembly errors quickly and the troubleshooting techniques to find and fix problems are introduced.
Applying the habits presented in this book will help every engineer design their next circuit board faster, with less chance of an unexpected problem, with the lowest noise. This textbook will also have embedded videos to visually demonstrate many of the hands-on processes introduced in this book.
BOGATIN’S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN Table of Contents Chapter 1 A Getting-Started Guide 1.1 Who This Book Is For 1.2 Getting Stuff Done 1.3 Cost-Performace Trade-offs 1.4 Errors, Best Practices, and Habits 1.5 Learn to Design-in Success 1.6 A Getting-Started Guide for Signal Integrity 1.7 The Seven-Step Process 1.8 Risk Management and Mitigation 1.9 Two Risk Management Design Strategies 1.0 Master of Murphy's Law 1.11 Proof of Concept 1.12 Practice Questions Chapter 2 PCB Technology 2.1 PCB, PWB, or PCA? 2.2 Physical Design of a PCB 2.3 Vias Technologies 2.4 Thermal and Thermal Relief Vias 2.5 Other Layers 2.6 The Soldermask Layer 2.7 Surface Finishes 2.8 The Silk Screen 2.9 What the Fab Vendor Needs 2.10 Practice Questions Chapter 3 Signal Integrity and Interconnects 3.1 Transparent Interconnects 3.2 When Interconnets are NOT Transparent 3.3 Where Signal Integrity Lives 3.4 Six Categories of Electrical Noise 3.5 Families of SI/PI/EMI Problems 3.6 In Principle and In Practice 3.7 Net Classes and Interconnect Problems 3.9 Design for X 3.10 Practice Questions Chapter 4 Electrical Properties of Interconnects 4.1 Ideal vs Real Circuit Elements 4.2 Equivalent Electrical Circuit Models 4.3 Parasitic Extraction of R, L, and C Elements 4.4 Describing Cross Talk 4.5 Estimating Mutual Inductance 4.6 Training Your Engineer’s Mind’s Eye 4.7 Electrically Long Interconnects 4.8 Electrically Short and Electrically Long 4.9 Practice Questions Chapter 5 Trace Width Considerations: Max Current 5.1 Best design practices 5.2 Minimum Fabrication Trace Width 5.3 Copper Thickness as Ounces of Copper 5.4 Maximum Current Handling of a Trace 5.5 Maximum Current Through a Via 5.6 Thermal Runaway with Constant Current 5.7 Practice Questions Chapter 6 Trace Width Considerations: Series Resistance 6.1 Resistance of Any Uniform Conductor 6.2 Sheet Resistance of a Copper Layer 6.3 Measuring Very Low Resistances 6.4 Voltage Drop Across Traces 6.5 The Thevenin Model of a Voltage Source 6.6 How Much Trace Resistance Is too Much? 6.7 The Resistance of a Via 6.8 Resistance of a Thermal Relief Via 6.9 Practice Questions Chapter 7 The Seven Steps in Creating a PCB 7.1 Step 1: Plan of Record 7.2 Step 2: Create the BOM 7.3 Step 3: Complete the Schematic 7.4 Step 4: Complete the Layout, Order the Parts 7.5 Steps 5 and 6: Assembly and Bring-Up 7.6 Step 7: Documentation 7.7 Practice Questions Chapter 8 Step 1, POR: Risk Mitigation 8.1 Visualize the Entire Project Before You Begin 8.2 Avoid Feature Creep 8.3 Estimate Everything You Can 8.4 Preliminary BOM: Critical Components 8.5 Risk Assessment 8.6 Risk Mitigation: Tented Vias 8.7 Risk Mitigation: Qualified Parts 8.8 Practice Questions Chapter 9 Risk Reduction: Datasheets, Reverse Engineering, and Component Selection 9.1 Take Responsibility for Your Design 9.2 Reducing the Risk of a Design Problem 9.3 Understand Your Circuit 9.4 Read Datasheets Critically 9.5 Build Simple Evaluation Prototypes 9.6 Reverse Engineer Components 9.7 Reuse Parts 9.8 Practice Questions Chapter 10 Risk Reduction: Virtual and Real Prototypes 10.1 Getting Started with Circuit Simulation 10.2 Practice Safe Simulation 10.3 Simulating a 555 Circuit 10.4 Purchase an Evaluation Board 10.5 Real Prototypes with Modules 10.6 Practice Questions Chapter 11 Risk Reduction: Prototyping with a Solderless Breadboard 11.1 Build a Real Prototype 11.2 Solderless Breadboards for POC 11.3 Features of a Solderless Breadboard 11.4 Bandwidth Limitations 11.5 A Simple Breakout Board 11.6 The Mini Solderless Breadboard 11.7 Best Wiring Habits 11.8 Habit 1: Consistent Column Assignments 11.9 Habit 2: Color Code the Wires 11.10 Habit 3: Keep Signal Traces Short 11.11 Habit 4: Avoid a Shared Return Path 11.12 Habit 5: Route Signal-Return Pairs 11.13 Habit 6: Keep Component Leads Short 11.14 Practice Questions Chapter 12 Switching Noise and Return Path Routing 12.1 The Origin of Switching Noise 12.2 Signal-Return Path Loops 12.3 Where Does Return Current Flow? 12.4 A Plane as a Return Path 12.5 Ground 12.6 Avoid Gaps in the Return Plane 12.7 Summary of the Best design practices 12.8 Practice Questions Chapter 13 Power Delivery 13.1 Origin of Power Rail Switching Noise 13.2 Calculating Loop Inductance 13.3 Measuring PDN Switching Noise 13.4 The Role of Decoupling Capacitors 13.5 Where Do Decoupling Capacitors Go? 13.6 The Power Delivery Path 13.7 Inrush Current 13.8 Summary of the Eight Habits for Using a SSB 13.9 Practice Questions Chapter 14 Design for Performance: The PDN on a PCB 14.1 VRM specifications 14.2 Voltage Regulator Module 14.3 Self- and Mutual-Aggression Noise 14.4 Power and Ground Loop Inductance 14.5 Decoupling Capacitors 14.6 A Decoupling Capacitor Myth; Part 1 14.7 A Decoupling Capacitor Myth; Part 2 14.8 Routing for Power Distribution 14.9 Ferrite Beads 14.10 Summary of the Best design practices 14.11 Practice Questions Chapter 15 Risk Reduction: Design for Bring-Up 15.1 Test is Too General a Term 15.2 What Does It Mean to “Work”? 15.3 Design for Bring-Up 15.4 Add Design for Bring-Up Features 15.5 Jumper Switches 15.6 LED indicators 15.7 Test Points 15.8 The Power Rail as a Diagnostic 15.9 Practice Questions Chapter 16 Risk Reduction: Design Reviews 16.1 The Preliminary Design Review 16.2 The Critical Design Review 16.3 DRC for DFM in the CDR 16.4 DRC for Signal Integrity 16.5 Layout Review 16.6 Practice Questions Chapter 17 Step 2: Surface-Mount or Through-Hole Parts 17.1 Through-Hole and Surface-Mount 17.2 Types of SMT Parts 17.3 Integrated Circuit Components 17.4 Practice Questions Chapter 18 Finding the One Part in a Million 18.1 An Important Selection Process 18.2 Trade-offs in Selecting Parts 18.3 The Search Order to Select a Part 18.4 Selecting Resistors 18.5 Selecting Capacitors 18.6 The BOM 18.7 Summary of the Best Design Practices 18.8 Selecting Parts for Automated Assembly 18.9 Practice Questions Chapter 19 Step 3: Schematic Capture and Final BOM 19.1 Picking a Project Name 19.2 Schematic Capture 19.3 Take Ownership of Reference Designs 19.4 Add Options to Your Schematic 19.5 Best design practices for Schematic Entry 19.6 Design Review and ERC 19.7 Practice Questions Chapter 20 Step 4: Layout — Setting Up the Board 20.1 Layout 20.2 Board Dimensions 20.3 The Layers in a Board Stack 20.4 Negative and Positive Layers 20.5 Examples of Some Fab Shop DFM Features 20.6 Setting Up Design Constraints 20.7 Thermal Reliefs in Pads and Vias 20.8 Set Up Board Size and Keepout Layer 20.9 Practice Questions Chapter 21 Floor Planning and Routing Priority 21.1 Part Placement 21.2 The Order of Placement and Routing 21.3 First Priority: Ground Plane on the Bottom Layer 21.4 Second Priority: Decoupling Capacitors 21.5 Third Priority: Ground Connections 21.6 Fourth Priority: Digital Signals, Congested Signals 21.7 Fifth Priority: Power Paths 21.8 The Silk Screen 21.9 Check the Soldermask 21.10 Soldermask Color 21.11 Layout — Critical Design Review 21.12 Practice Questions Chapter 22 Six Common Misconceptions about Routing 22.1 Myth 1: Avoid 90 Deg Corners 22.2 Myth 2: Add Copper Pour on Signal Layers 22.3 Myth 3: Use Different Value Decoupling Capacitors 22.4 Myth 4: Split Ground Plan 22.5 Myth 5: Use Power Planes 22.6 Myth 6: Use 50 Ohm Impedance Traces 22.7 Practice Questions Chapter 23 Four-Layer Boards 23.1 Two-Layer Stack-Ups 23.2 A 4-Layer Board 23.3 Four-Layer Stack-Up Options 23.4 Stack-Up Options with Two Planes 23.5 The Recommended 4-Layer Stack-Up 23.6 When Signals Change Return Planes 23.7 Practice Questions Chapter 24 Release the Board to the Fab Shop 24.1 Gerber Files 24.2 Cost Adders 24.3 Board Release Checklist 24.4 Practice Questions Chapter 25 Step 6: Bring-Up 25.1 Does Your Widget Work? 25.2 Prototype or Production Testing 25.3 Design for Bring-Up 25.4 Find the Root Cause 25.5 Problems to Expect 25.6 Troubleshoot Like a Detective 25.7 Trick 1: Recreate the Problem 25.8 Trick 2: Seen This Problem Before? 25.9 Trick 3: Round Up the Usual Suspects 25.10 Trick 4: Three Possible Explanations 25.11 A Methodology 25.12 Forensic Analysis 25.13 Coding Issues 25.14 Practice Questions Chapter 26 Step 7: Documentation Chapter 27 Concluding Comments Chapter 28 About Eric Bogatin
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